Show simple item record

dc.contributor.authorChen Guo-Liang
dc.contributor.author陈国良
dc.contributor.authorZhou Jian-Zhang
dc.contributor.author周剑章
dc.contributor.authorLin Zhong-Hua
dc.contributor.author林仲华
dc.contributor.authorLu Jiang-Hong
dc.contributor.author卢江红
dc.contributor.authorLin Jin-Mei
dc.contributor.author林进妹
dc.date.accessioned2011-07-04T05:30:07Z
dc.date.available2011-07-04T05:30:07Z
dc.date.issued2006
dc.identifier.citationCHEMICAL JOURNAL OF CHINESE UNIVERSITIES-CHINESE,2006,27(9):1699-1702zh_CN
dc.identifier.issn0251-0790
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/9996
dc.description.abstractThe anodic dissolution and cathodic deposition of Cu and effect of allyl thiourea on the processes in acidic media were investigated by using cyclic voltammetry and EQCM. The experimental results demonstrated that there is only one current peak in the anodic dissolution and cathodic deposition of Cu, the M/n value of which is 32.0 and 34.2 g/mol, respectively, showing that the anodic dissolution and cathodic deposition of Cu correspond to the two-electron processes. No Cu (+) ions, adsorbed Cu ( I ) species or intermediate Cu (+) was evidenced by in situ EQCM measurements, allyl thiourea may change the mechanism of the anodic dissolution and cathodic deposition of Cu. The M/n values of the anodic dissolution and cathodic deposition of Cu in the presence of allyl thiourea are 61.9 and 65.4 g/mol, respectively, indicating the one-electron processes and producing Cu( I ) species. The mechanism of the anodic dissolution and cathodic deposition of Cu can be considered as: AT(solution) = AT(suface) ; Cu = Cu (+) (solution) + e; Cu (+) + AT = (CuAT) (+) (solution). The EQCM studies provided quantitative results of surface mass changes during cathodic deposition and anodic dissolution of Cu, and threw a new light in the elucidating electrodeposition and anodic dissolution of Cu.zh_CN
dc.language.isozhzh_CN
dc.publisherHIGHER EDUCATION PRESSzh_CN
dc.subjectcopperzh_CN
dc.subjectelectrochemical quartz crystal microbalancezh_CN
dc.subjectelectro depositionzh_CN
dc.subjectanodic dissolutionzh_CN
dc.subjectallyl thioureazh_CN
dc.titleEQCM study of effect of allyl thiourea on anodic dissolution and cathodic deposition of Cu in acidic mediazh_CN
dc.typeArticlezh_CN


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record