Show simple item record

dc.contributor.authorYang Fang-Zu
dc.contributor.author杨防祖
dc.contributor.authorYang Bin
dc.contributor.author杨斌
dc.contributor.authorHuang Ling
dc.contributor.author黄令
dc.contributor.authorXu Shu-Kai
dc.contributor.author许书楷
dc.contributor.authorZhou Shao-Min
dc.contributor.author周绍民
dc.date.accessioned2011-06-28T15:28:59Z
dc.date.available2011-06-28T15:28:59Z
dc.date.issued2006
dc.identifier.citationACTA PHYSICO-CHIMICA SINICA,2006,22(11):1317-1320zh_CN
dc.identifier.issn1000-6818
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/9845
dc.description.abstractThe process of electroless copper plating, using sodium hypophosphite as the reductant and sodium citrate as the chelating agent, was studied using linear sweep voltametry. The effects of temperature, pH, and concentration of nickel ion on the anodic oxidation of hypophosphite and the cathodic reduction of copper ion were tested. The results indicated that the higher ultrasonic bath temperature accelerated both the anodic and the cathodic processes. The increasing pH value promoted hypophosphite oxidation, whereas it blocked the reduction of the copper ion. The nickel ion not only intensively catalyzed the hypophosphite oxidation, but also codeposited with the copper ion to form the CuNi alloy. With regard to its catalytic activity, this alloy enabled the continuation of the electroless copper plating reaction.zh_CN
dc.language.isozhzh_CN
dc.publisherPEKING UNIV PRESSzh_CN
dc.subjectelectroless copper platingzh_CN
dc.subjectsodium hypophosphitezh_CN
dc.subjectre-active agentzh_CN
dc.subjectanodic oxidationzh_CN
dc.subjectcathodic reductionzh_CN
dc.titleElectrochemical study on electroless copper plating using sodium hypophosphite as reductantzh_CN
dc.typeArticlezh_CN


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record