2DC/SiC复合材料高温蠕变损伤的显微CT分析
Micro-CT analysis of high temperature creep damage of 2D C/SiC composites
Abstract
利用显微CT针对自愈合2dC/SIC复合材料高温蠕变试验前后的内部孔隙率进行了分。析结果表明,显微CT技术能较好地探测高温蠕变前后2dC/SIC复合材料内部孔隙率变化,从孔隙率的变化初步证实了bXC组元对2dC/SIC复合材料有一定的自愈合作用。利用显微CT技术证实了高温下的拉伸应力不会导致2dC/SIC复合材料中新的裂纹产生。 We report a micro-CT experiment that permits us to assess void growth and microstructure development in self-healing 2D C/SiCcomposites subjected to high temperature creep.The results reveal that the micro-CT is a promising facility to detect the evolution of voidsin 2D C/SiC composites,and the BxC composition plays a positive role in the self-healing behavior of the composites subjected to hightemperature.In addition,the results show that high temperature creep will not lead to new cracks in the composites,which may be caused bythe self-healing of matrix cracks.