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Electrochemical corrosion behavior of copper clad laminate in NaCl solution

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覆铜板在NaCl溶液中的腐蚀电化学行为.pdf (373.9Kb)
Date
2007
Author
Zhao Yan
赵岩
Lin Chang-Jian
林昌健
Li Yan
李彦
Du Rong-Gui
杜荣归
Wang Jing-Run
王景润
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  • 化学化工-已发表论文 [14235]
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Abstract
Comparing with pure copper, the corrosion behavior of copper clad laminate (CCL) in NaCl solution was studied by using linear polarization, cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS). It was shown that CCL had a different corrosion behavior and showed a lower corrosion resistance compared with the pure copper. At low polarization potential, CCL dissolves through the formation of CuCl2-, which may be a determined step in the anodic process. And when the polarization potential increased, a porous film containing CuCl formed on the CCL surface, and the transportation of Cl- in the film became the controlling step in the corrosion process. An inductive loop at low frequency was observed in the EIS measurement, which was attributed to the modulation of CuCl film due to the competition between dissolution and growth processes on CCL surface.
Citation
ACTA PHYSICO-CHIMICA SINICA,2007,23(9):1342-1346
URI
http://dx.doi.org/doi:CNKI:SUN:WLHX.0.2007-09-010
https://dspace.xmu.edu.cn/handle/2288/9303

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