Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface
- 化学化工－已发表论文 
The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker-Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s(-1), the density of active nucleation sites (N-0) increased from 6.10x10(5) to 1.42x10(6) cm(-2), and the diffusion coefficient (D) was (6.13+/-0.62) x 10(-6) cm(2).s(-1).