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dc.contributor.authorYang Weizh_CN
dc.contributor.authorLin Jingzh_CN
dc.contributor.authorGuo YinBiaozh_CN
dc.contributor.author杨炜zh_CN
dc.contributor.author林静zh_CN
dc.date.accessioned2015-07-22T02:35:40Z
dc.date.available2015-07-22T02:35:40Z
dc.date.issued2010zh_CN
dc.identifier.citation5TH INTERNATIONAL SYMPOSIUM ON ADVANCED OPTICAL MANUFACTURING AND TESTING TECHNOLOGIES: ADVANCED OPTICAL MANUFACTURING TECHNOLOGIES, 2010,7655zh_CN
dc.identifier.otherWOS:000287795800040zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/85990
dc.descriptionConference Name:5th International Symposium on Advanced Optical Manufacturing and Testing Technologies - Advanced Optical Manufacturing Technologies. Conference Address: Dalian, PEOPLES R CHINA. Time:APR 26-29, 2010.zh_CN
dc.description.abstractThis paper researches on the planarization of the large optic wafer in the fast polishing process (FPP). In the FPP, the MRR (material removal rate) of the large optic wafer can reach 5 similar to 10 um/h. However, the planarization of the wafer is still a problem. Thus, this paper uses the revised skin model to analyze the non-uniform pressure distribution which results in the non-planarization of the wafer. At last, some experiments are done to see which parameter can be chosen to avoid the non-uniform pressure distribution and get the good wafer planarization.zh_CN
dc.language.isoen_USzh_CN
dc.publisherP SOC PHOTO-OPT INSzh_CN
dc.source.urihttp://dx.doi.org/10.1117/12.863594zh_CN
dc.titleResearch on the planarizaion of the large optic wafer in the fast polishing processzh_CN
dc.typeConferencezh_CN


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