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dc.contributor.authorXu, L.S.zh_CN
dc.contributor.authorChen, X.H.zh_CN
dc.contributor.authorLiu, X.J.zh_CN
dc.contributor.author刘兴军zh_CN
dc.date.accessioned2015-07-22T01:36:56Z
dc.date.available2015-07-22T01:36:56Z
dc.date.issued2013zh_CN
dc.identifier.citationApplied Mechanics and Materials, 2013,275-277:1789-1793zh_CN
dc.identifier.issn1660-9336zh_CN
dc.identifier.other20130716013420zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/85109
dc.descriptionConference Name:2012 International Conference on Applied Mechanics and Materials, ICAMM 2012. Conference Address: Sanya, China. Time:November 24, 2012 - November 25, 2012.zh_CN
dc.description.abstractMulti-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were prepared using a unique spherical MWCNT-implanted copper composite powders. The MWCNTs are homogenously 'locked' in the composite and tightly bonded to the matrix, which makes them play excellent reinforcement role on the microhardness compared with the unreinforced pure copper. Although the thermal conductivity is not enhanced for the thermal resistance between the carbon nanotubes and the copper matrix; it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the thermal expansion of the composites decreased apparently with the addition of the carbon nanotubes. ? (2013) Trans Tech Publications, Switzerland.zh_CN
dc.language.isoen_USzh_CN
dc.publisherTrans Tech Publicationszh_CN
dc.source.urihttp://dx.doi.org/10.4028/www.scientific.net/AMM.275-277.1789zh_CN
dc.subjectCarbon nanotubeszh_CN
dc.subjectComposite materialszh_CN
dc.subjectCopperzh_CN
dc.subjectElectronics packagingzh_CN
dc.subjectMetallic matrix compositeszh_CN
dc.subjectReinforced plasticszh_CN
dc.subjectReinforcementzh_CN
dc.subjectThermal expansionzh_CN
dc.titlePreparation and properties of carbon nanotubes reinforced Cu matrix composites for electronic packaging applicationzh_CN
dc.typeConferencezh_CN


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