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dc.contributor.author谢治辉zh_CN
dc.contributor.author余刚zh_CN
dc.contributor.authorXIE Zhi-huizh_CN
dc.contributor.authorYU Gangzh_CN
dc.date.accessioned2014-12-19T07:06:20Z
dc.date.available2014-12-19T07:06:20Z
dc.date.issued2014-12-28zh_CN
dc.identifier.citation电化学,2014,20(6):576-581.zh_CN
dc.identifier.issn1006-3471zh_CN
dc.identifier.urihttp://dx.doi.org/10.13208/j.electrochem.140321zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/80554
dc.description.abstract通过极化曲线研究了3种不同溶液(阴极液、阳极液和完整镀液)的电化学行为,测定了主盐、还原剂浓度以及镀液pH和体系温度对化学镀镍沉积速率的影响. 与直接在镁合金上化学镀镍并使用重量分析法得到的沉积速率相比较发现,完整镀液体系的极化曲线才能真实地反映化学镀镍的沉积过程,其过程不能简单视为由彼此完全独立毫无关联的阴阳极半反应构成. 根据Butler-Volmer公式,本化学镀液体系的化学镀镍过程属混合控制,其表观反应活化能为42.89 kJ·mol-1.zh_CN
dc.description.abstractElectrochemical behaviors of electroless nickel (EN) plating in three systems, namely, cathodic, anodic and complete bath solutions were investigated by polarization methods. The curves in the complete baths were not entirely consistent with those expected from a combination of the anodic and cathodic polarization curves, which implies that the anodic and cathodic reactions of the EN plating are interdependent. The effects of concentration of nickel ions, hypophosphite and pH on the polarization parameter and deposition rate in a complete bath were also discussed and compared by performing electrochemical and gravimetrical measurements. Based on these variations in the deposition potential and current density, a kinetic expression employing the Butler-Volmer equation is suggested and verified with the experimental findings. It was confirmed that the electroless nickel deposition processes in the present system was under a mixed control. The apparent activation energy determined by electrochemical methods was about 42.89 kJ·mol-1.zh_CN
dc.description.sponsorship四川省教育厅自然科学项目(No. 14ZB0147)和中央高校基本科研业务费专项(No. 13E006)资助zh_CN
dc.language.isozhzh_CN
dc.publisher厦门大学《电化学》编辑部zh_CN
dc.relation.ispartofseries研究论文zh_CN
dc.relation.ispartofseriesArticleszh_CN
dc.source.urihttp://electrochem.xmu.edu.cn/CN/abstract/abstract10123.shtmlzh_CN
dc.subject化学镀zh_CN
dc.subject极化zh_CN
dc.subject电化学机理zh_CN
dc.subject混合电势理论zh_CN
dc.subject沉积速率zh_CN
dc.subjectelectroless platingzh_CN
dc.subjectpolarizationzh_CN
dc.subjectelectrochemical mechanismzh_CN
dc.subjectmixed potential theoryzh_CN
dc.subjectdeposition ratezh_CN
dc.title酸性化学镀镍磷合金的动力学机理zh_CN
dc.title.alternativeKinetics and Mechanism of Acidic Electroless Ni-P Platingzh_CN
dc.typeArticlezh_CN
dc.description.note作者联系地址:1. 西华师范大学 化学化工学院,化学合成与污染控制四川省重点实验室,四川 南充 637002;2. 湖南大学 化学化工学院,化学生物传感与计量学国家重点实验室,湖南 长沙410082zh_CN
dc.description.noteAuthor's Address: 1. Chemical Synthesis and Pollution Control Key Laboratory of Sichuan Province, College of Chemistry and Chemical Engineering , China West Normal University, Nanchong 637002, Sichuan, China; 2. State Key Laboratory of Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, Chinazh_CN
dc.description.note通讯作者E-mail:zhihuixie@yeah.net; yuganghnu@163.comzh_CN


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