Electrodeposition of Copper from a Choline Chloride based Ionic Liquid
M. Rostom Ali
Md. Ziaur Rahman
- 2014年第20卷 
采用恒电流和恒电位方法，基于含有氯化铜溶液的乙二醇-氯化胆碱或硫脲-氯化胆碱离子液体，室温下在钢阴极上进行了铜的电沉积. 利用扫描电子显微镜和X-射线衍射技术研究了各种实验条件对电沉积的影响以及沉积层的形貌. 结果表明，室温下施加不超过-0.45 V的沉积电位和不超过-4.0 A·m-2的沉积电流密度，可以同时从氯化胆碱基乙二醇和硫脲离子液体中沉积得到非常光滑、有光泽、致密且具有良好结合力、色泽鲜艳的铜金属涂层. 铜的电沉积阴极电流效率约为97%.The electrodeposition of copper from a solution containing copper chloride in either an ethylene glycol (EG)-choline chloride based or a urea-choline chloride based ionic liquid has been carried out onto a steel cathode by constant current and constant potential methods at room temperature. The influences of various experimental conditions on electrodeposition and the morphology of the deposited layers have been investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). It is shown that very smooth, shiny and dense with good adherence and bright metallic coloured copper coatings can be obtained from both EG and urea based ionic liquids at the applied deposition potentials up to -0.45 V and applied deposition current densities up to -4.0 A·m-2 at room temperature. The cathodic current efficiency for the deposition of copper is about 97%.