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dc.contributor.author章小鸽zh_CN
dc.contributor.authorGregory X.Zhangzh_CN
dc.date.accessioned2013-11-18T07:46:07Z
dc.date.available2013-11-18T07:46:07Z
dc.date.issued2006-02-28zh_CN
dc.identifier.citation电化学,2006,12(01):1-8.zh_CN
dc.identifier.issn1006-3471zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/58014
dc.description.abstract从原子水平到微米尺寸,准确控制硅表面结构的精密加工,诸如无序的表面粗糙或者精细的图案,乃是电子元件性能及其可靠性的保证.硅在液中的湿清洗以及硅表面侵刻的电化学反应对硅表面结构的形成具有重要作用.近数十年来,有关阐明和控制硅/溶液界面上复杂的电化学反应及其与表面结构形成的关系已有大量的研究,相关研究成果已在新近编著成书.本文综合有关方面研究资料评述现代硅溶解及其形成的表面结构.zh_CN
dc.description.abstractAccurate control and fabrication of silicon surface structures from atomic scale to micrometer scale,which may be randomly associated with surface roughness or have well defined patterns,is critical for the per-formance and reliability of electronic devices.Electrochemical reactions of silicon in solutions involved in wetcleaning and etching of silicon wafer play an importantrole in determining the structures of silicon surface.Atre-mendous amount of researches have been done in the last several decades to understand and control a range ofcomplex electrochemical reactions at silicon/solution interface and their relations to the resulted surface struc-tures.The findings generated from these research efforts have been compiled and integrated in a recently pub-lished book.This paper is to present an overview,using synthesized information from this book,on the aspect ofsilicon dissolution and the resulted surface structures.zh_CN
dc.language.isozhzh_CN
dc.publisher厦门大学《电化学》编辑部zh_CN
dc.relation.ispartofseries研究论文zh_CN
dc.relation.ispartofseriesArticleszh_CN
dc.source.urihttp://electrochem.xmu.edu.cn/CN/abstract/abstract8847.shtmlzh_CN
dc.subjectzh_CN
dc.subject侵刻zh_CN
dc.subject溶解zh_CN
dc.subject表面结构zh_CN
dc.subject器件加工zh_CN
dc.subject表面反应zh_CN
dc.subject微机电系统zh_CN
dc.subjectSiliconzh_CN
dc.subjectEtchingzh_CN
dc.subjectDissolutionzh_CN
dc.subjectSurface structurezh_CN
dc.subjectMicro device fabricationzh_CN
dc.subjectSurface reactionszh_CN
dc.subjectMEMSzh_CN
dc.title硅的表面结构与电化学(英文)zh_CN
dc.title.alternativeElectrochemistry and Structures of Silicon Surfacezh_CN
dc.typeArticlezh_CN
dc.description.note作者联系地址:加拿大安大略Teck comino金属有限公司 厦门大学化学系,,福建厦门361005zh_CN
dc.description.noteAuthor's Address: Teck Cominco Metals Ltd,Ontario,Canada;Department ofChemistry,Xiaman University,Xiaman,Fujian,Chinazh_CN


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