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dc.contributor.author王增林zh_CN
dc.contributor.author刘志鹃zh_CN
dc.contributor.author姜洪艳zh_CN
dc.contributor.author王秀文zh_CN
dc.contributor.author新宫原正三zh_CN
dc.contributor.authorWANG Zeng-linzh_CN
dc.date.accessioned2013-11-18T07:46:05Z
dc.date.available2013-11-18T07:46:05Z
dc.date.issued2006-05-28zh_CN
dc.identifier.citation电化学,2006,12(02):125-133.zh_CN
dc.identifier.issn1006-3471zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/57995
dc.description.abstract总结自大马士革铜工艺建立以来,电化学工作者利用化学镀技术围绕该工艺而开展的一系列相关研究,介绍了应用化学镀沉积镍三元合金防扩散层和化学镀铜种子层的研究以及离子束沉积法(Ion ized C lus-ter Beam,ICB)形成Pd催化层后的化学镀铜技术和超级化学镀铜方法.简要叙述化学镀铜技术在超大规模集成电路中的应用,总结化学镀铜技术的研究进展,并指出了今后的发展方向.zh_CN
dc.description.abstractIn this paper,research progresses in electroless plating for damascene copper process were reviewed.Electroless nickel ternary alloy deposition for barrier layer and electroless copper plating for seed layer were presented.Bottom-up copper fill high-aspect-via-hole and electroless plating after ICB-Pd catalytic layer for seed layer were mainly introduced.The applications of electroless plating in ultralarge-scale integration were discussed,and the developing tendency was also suggested.zh_CN
dc.language.isozhzh_CN
dc.publisher厦门大学《电化学》编辑部zh_CN
dc.relation.ispartofseries研究论文zh_CN
dc.relation.ispartofseriesArticleszh_CN
dc.source.urihttp://electrochem.xmu.edu.cn/CN/abstract/abstract8828.shtmlzh_CN
dc.subject化学镀铜zh_CN
dc.subject超级化学镀zh_CN
dc.subject大马士革铜互连线zh_CN
dc.subject种子层zh_CN
dc.subject防扩散层zh_CN
dc.subjectElectroless copper platingzh_CN
dc.subjectBottom-up fillzh_CN
dc.subjectDamascene copper interconnectionzh_CN
dc.subjectSeed layerzh_CN
dc.subjectBarrier layerzh_CN
dc.title化学镀技术在超大规模集成电路互连线制造过程的应用zh_CN
dc.title.alternativeApplication of Electrolessplating Technology in Interconnection Manufacturing of Ultralarge-scale Integrationzh_CN
dc.typeArticlezh_CN
dc.description.note作者联系地址:陕西师范大学化学与材料科学学院,陕西师范大学化学与材料科学学院,陕西师范大学化学与材料科学学院,陕西师范大学化学与材料科学学院,关西大学工学部机械工学科 陕西西安710062,陕西西安710062,陕西西安710062,陕西西安710062,日本大阪,5648680zh_CN
dc.description.noteAuthor's Address: *1,LIU Zhi-juan~1,JIANG Hong-yan~1,WANG Xiu-wen~1,Shoso Shingubara~21.School of Chemistry and Materials Science,Shaanxi Normal University,Xi'an 710062,Shaanxi,China,2.Faculty of Engineering,Kansai University,Osaka,564-8680,Japanzh_CN


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