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dc.contributor.author张大为zh_CN
dc.contributor.author袁华堂zh_CN
dc.contributor.author杨化滨zh_CN
dc.contributor.author周作祥zh_CN
dc.contributor.author张允什zh_CN
dc.contributor.authorZhang Daweizh_CN
dc.contributor.authorYuan Huatang
dc.contributor.authorYang Huabin
dc.contributor.authorZhou Zuoxiang
dc.contributor.authorZhang Yunshi
dc.date.accessioned2013-11-18T07:43:51Z
dc.date.available2013-11-18T07:43:51Z
dc.date.issued1997-08-28zh_CN
dc.identifier.citation电化学,1997,3(03):263-270.zh_CN
dc.identifier.issn1006-3471zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/57296
dc.description.abstract在密封的电池体系中(即贫液状态),包铜储氢合金电极具有较好的抗氧化能力;而在强碱性溶液中(即富液状态),铜在电极工作的电位范围内(-1.1~-0.4V)具有一定的稳定性,但当扩展扫描范围(-1.1~-0.2V),将出现铜的氧化还原反应.随着充放电循环的进行,铜被氧化成Cu2O,进而形成CuO2-2进入电解质(KOH)溶液中,充电时又以Cu的形式于电极表面析出.针对这一现象,本文利用电位阶跃实验研究了CuO2-2离子在镍电极上的电沉积过程,结果表明该过程遵循二维瞬时成核机理zh_CN
dc.description.abstractNegative electrode made from Cu microencapsulated hydrogen storage alloy was studied by using cyclic voltammetry method. The results showed that copper as a coating material was of a certain stability in 5 mol/L KOH solution within the range of charge and discharge voltage. But when expanding the sweep voltage, the CV curve showed a pair of distinct oxidation reduction current peaks of Cu 2O formation at E =-0.3 V and Cu 2O reduction at E =-0.6 V. With charging discharging cycles, copper is liable to be oxidized to Cu 2O and further oxidized into CuO 2- 2. When charged again, CuO 2- 2 anion is reduced and Cu is electrodeposited on the sufrace of electroce. In respond to this phenomenon, the electrodeposition process of CuO 2- 2 on the smooth Ni electrode was studied by constant potential step technique. The results showed that the deposition process of copper followed the two dimension instantaneous mechanism.zh_CN
dc.language.isozhzh_CN
dc.publisher厦门大学《电化学》编辑部zh_CN
dc.relation.ispartofseries研究论文zh_CN
dc.relation.ispartofseriesArticleszh_CN
dc.source.urihttp://electrochem.xmu.edu.cn/CN/abstract/abstract9552.shtmlzh_CN
dc.subject储氢合金zh_CN
dc.subject表面包覆zh_CN
dc.subjectzh_CN
dc.subject循环伏安zh_CN
dc.subject电位阶跃zh_CN
dc.subject电沉积zh_CN
dc.subjectHydrogen storage alloyzh_CN
dc.subjectMicroencapsulationzh_CN
dc.subjectCopperzh_CN
dc.subjectCyclic voltammetryzh_CN
dc.subjectConstant potential step techniquezh_CN
dc.subjectElectrodepositionzh_CN
dc.title铜在储氢合金表面包铜电极中的行为zh_CN
dc.title.alternativeBehavior of Copper in Hydrogen Storage Alloy Microencapsulated by Copperzh_CN
dc.typeArticlezh_CN
dc.description.note作者联系地址:南开大学新能源材料化学研究所zh_CN
dc.description.noteAuthor's Address: Inst. of New Energy Material Chem., Nankai Univ., Tianjin 300071zh_CN


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