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dc.contributor.author韩克平zh_CN
dc.contributor.author方景礼zh_CN
dc.contributor.authorHan Kepingzh_CN
dc.contributor.authorFang Jingli
dc.date.accessioned2013-11-18T07:43:39Z
dc.date.available2013-11-18T07:43:39Z
dc.date.issued1996-05-28zh_CN
dc.identifier.citation电化学,1996,2(02):198-201.zh_CN
dc.identifier.issn1006-3471zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/57246
dc.description.abstract用重量法测定了卤离子对化学沉积镍速度的影响.并借助电化学方法研究了卤离子对镍的化学沉积过程的极化曲线和稳定电位的影响.探讨了卤离子加速和稳定化学沉积镍的机理zh_CN
dc.description.abstractThe effect of halide ions on the polarization curves and stationary potential of electroless nickel plating process were studied with electrochemical methods. The acceleration and stabilization mechanism of electroless nickel deposition by halide ions also has been discussed.zh_CN
dc.language.isozhzh_CN
dc.publisher厦门大学《电化学》编辑部zh_CN
dc.relation.ispartofseries研究论文zh_CN
dc.relation.ispartofseriesArticleszh_CN
dc.source.urihttp://electrochem.xmu.edu.cn/CN/abstract/abstract9661.shtmlzh_CN
dc.subject化学沉积镍zh_CN
dc.subject卤离子zh_CN
dc.subject电化学方法zh_CN
dc.subjectElectroless nickel depositionzh_CN
dc.subjectHalide ionszh_CN
dc.subjectElectrochemical methodszh_CN
dc.title卤离子对化学沉积镍的影响zh_CN
dc.title.alternativeEffect of Halide Ions on the Deposition of Electroless Nickelzh_CN
dc.typeArticlezh_CN
dc.description.note作者联系地址:南京大学化学系应用化学研究所zh_CN
dc.description.noteAuthor's Address: Chem. Depart., Applied Chem. Inst., Nanjing University, Nanjing 210093zh_CN


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