Show simple item record

dc.contributor.author周春根zh_CN
dc.contributor.author段淑贞zh_CN
dc.contributor.authorZhou Chungenzh_CN
dc.contributor.authorDuan Shuzhenzh_CN
dc.date.accessioned2013-11-18T07:43:27Z
dc.date.available2013-11-18T07:43:27Z
dc.date.issued1995-02-28zh_CN
dc.identifier.citation电化学,1995,1(01):93-96.zh_CN
dc.identifier.issn1006-3471zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/57192
dc.description.abstract钇离子在铜电极上的电极过程及表面合金化周春根,段淑贞(北京科技大学理化系,北京100083)通过熔盐电化学表面合金化方法获得的镀层非常均匀、无裂纹,具有很强的抗腐蚀性能,其原因是获得的合金镀层系由一种金属原子向另一种基体金属表面扩散的结果 ̄[1,2]...zh_CN
dc.description.abstractThe reduction of yttrium ion on copper electrode in NaCl-KCl-YCl_3 molten saltshas been investigated.The results indicate that the formation of intermetallic compounds is occuredbefore the metallic yttrium to be formed.The formation of intermetallic compounds is controlled bythe process of which yttrium atoms are diffusing into copper electrode.The kinetic characters todiffusion of yttrium atoms were also discussed.zh_CN
dc.language.isozhzh_CN
dc.publisher厦门大学《电化学》编辑部zh_CN
dc.relation.ispartofseries研究论文zh_CN
dc.relation.ispartofseriesArticleszh_CN
dc.source.urihttp://electrochem.xmu.edu.cn/CN/abstract/abstract9767.shtmlzh_CN
dc.subjectYttriumzh_CN
dc.subjectElectrode processzh_CN
dc.subjectMetallizingzh_CN
dc.subjectCyclic voltammetryzh_CN
dc.title钇离子在铜电极上的电极过程及表面合金化zh_CN
dc.title.alternativeThe Electrode Process of Y(Ⅲ)on Copper Electrode and Its Surface Metallizingzh_CN
dc.typeArticlezh_CN
dc.description.note作者联系地址:北京科技大学理化系,北京航空航天大学103教研室zh_CN
dc.description.noteAuthor's Address: Department of Physical Chemistry,Univeraity of Science and Technology Beijing, Beijing 100083zh_CN


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record