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dc.contributor.author董献堆zh_CN
dc.contributor.author陆君涛zh_CN
dc.contributor.author查全性zh_CN
dc.contributor.authorDong Xianduizh_CN
dc.contributor.authorLu Juntaozh_CN
dc.contributor.authorCha Chuanxinzh_CN
dc.date.accessioned2013-11-18T07:43:26Z
dc.date.available2013-11-18T07:43:26Z
dc.date.issued1995-02-28zh_CN
dc.identifier.citation电化学,1995,1(01):25-29.zh_CN
dc.identifier.issn1006-3471zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/57181
dc.description.abstract巯基羧酸吸附在金电极表面形成自组装单分子层,其中巯基与金共价结合,而裸露在表面的羧基可用于进一步修饰.用逐层反应的方法,可通过乙二胺将二茂铁羧酸结合在自组装单分子层上.电极的行为用电化学方法进行了表征.zh_CN
dc.description.abstractThe self-assembled monolayers,which were built by spontaneous adsorption of ω-carboxylic acid thiols on gold surface,were used as substrate for further modification through later bylayer amide surface reactions.At each stage of modification,the gold surface was characterizedelectochemieally. The results demonstrated that the strategies of layer by layer self assembly is ofsignificant potential for fabrieating functionalized ultrathin layers.zh_CN
dc.language.isozhzh_CN
dc.publisher厦门大学《电化学》编辑部zh_CN
dc.relation.ispartofseries研究论文zh_CN
dc.relation.ispartofseriesArticleszh_CN
dc.source.urihttp://electrochem.xmu.edu.cn/CN/abstract/abstract9756.shtmlzh_CN
dc.subject自组装单分子层zh_CN
dc.subject金电极zh_CN
dc.subject逐层修饰zh_CN
dc.subjectSelf.assembled monolayerzh_CN
dc.subjectGold electredezh_CN
dc.subjectLayer by layer medificationzh_CN
dc.title逐层自组装修饰金电极zh_CN
dc.title.alternativeSelf Assembly via Layer by Layer Surface Reaction on Gold Electrodes and the Electrochcmical Characterizationzh_CN
dc.typeArticlezh_CN
dc.description.note作者联系地址:武汉大学化学系zh_CN
dc.description.noteAuthor's Address: Depertment of Chemistry,Wuhan University, Wuhan 430072zh_CN


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