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dc.contributor.author罗学涛zh_CN
dc.contributor.author吴清良zh_CN
dc.contributor.author黄前军zh_CN
dc.contributor.author陈立富zh_CN
dc.date.accessioned2011-04-26T08:03:47Z
dc.date.available2011-04-26T08:03:47Z
dc.date.issued2003-12zh_CN
dc.identifier.citation复合材料学报,2003(6):151-154zh_CN
dc.identifier.issn1000-3851zh_CN
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/2450
dc.description.abstract[中文文摘]基于电化学浸渗技术(ECI)在室温下制备了连续铜纤维、碳纤维和玻璃纤维增强铜基复合材料。实验结果表明,在本实验工艺条件下可获得致密的纤维/Cu基复合材料,并具有优良的力学性能。复合材料的断口形貌及显微结构的SEM观察表明,纤维与铜基体之间的界面结合良好,纤维不受任何损伤。证实了ECI在室温下快速制备纤维增强金属基复合材料的可行性。[英文文摘]Continuous-fiber-reinforced Cu matrix composites were fabricated based on the electrochemical infiltration technique (ECI). The experimental results show that the dense fiber/Cu composites have been obtained on the present condition, which possess good mechanical properties. The fracture surface morphology and microstructures of the composites have been observed by SEM. It is indicated that the interfacial bond between fibers and Cu matrix is very well and the fibers do not have any damage. The ECI is feasible to prepare rapidly fiber reinforced metal matrix composites at room temperature.zh_CN
dc.language.isozhzh_CN
dc.publisher北京航空航天大学zh_CN
dc.subject铜基复合材料zh_CN
dc.subject电化学浸渗zh_CN
dc.subject显微结构zh_CN
dc.subject力学性能zh_CN
dc.subjectcopper matrix compositezh_CN
dc.subjectelectrochemical infiltrationzh_CN
dc.subjectmicrostructurezh_CN
dc.subjectmechanical propertyzh_CN
dc.title电化学浸渗法制备纤维/铜基复合材料zh_CN
dc.title.alternativeFIBER-REINFORCED COPPER MATRIX COMPOSITES FABRICATED BY ELECTROCHEMICAL INFILTRATION TECHNIQUEzh_CN
dc.typeArticlezh_CN


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