无铅焊料用环保型助焊剂及焊锡膏的 制备与性能研究
Preparation and Study of the Performance of Environmental Friendly Flux and Solder Paste for Lead-free Solder Using
Abstract
随着电子行业和表面组装技术(SMT)的发展，助焊剂与焊膏已经成为电子工业中最为重要的电子互连材料之一。本课题分析总结了实验室已开发的Sn-3.5Ag-0.5Cu块状焊料用助焊剂的各项添加物，从助焊剂的各项功能性添加物出发，改善了助焊剂的配方，从而满足环保需求；针对现有焊膏残留过高的问题，本论文开发出了一款无松香Sn-3.0Ag-0.5Cu系焊膏，并对其进行了润湿性、坍塌及焊料球等方面的研究和综合评价；针对无铅焊料熔点过高的问题，本论文开发了一种新型核/壳结构系粉体材料，并将其应用于焊膏中，对其性能进行了初步探讨。本论文的主要研究成果如下： (1)原有Sn-3.5Ag-0.5Cu块状焊料用助焊... With the development of electronic industry and surface mount technology (SMT), flux and solder paste have become one of the most important electronic jointing materials in electronic industry. This paper analyzed the properties of the different kinds of flux additives used for Sn-3.5Ag-0.5Cu bulk solder. A new type of flux has been developed by adjusting the functional elements of flux to meet th...