陶瓷材料的实际烧结及其计算机仿真研究
Practical Sintering and Computer Simulation of Ceramics
Abstract
陶瓷材料在烧成过程中通常会发生晶粒和气孔的数量、大小和形状的变化。本文采用传统的固相反应法制备BaTiO3和PZT陶瓷，获得陶瓷微观形貌的SEM照片和陶瓷宏观形状的CCD照片，以及气孔率和收缩率的定量数据，表明烧结体随着气孔减少而收缩；使用IPP软件对SEM照片进行图像处理，获得晶粒生长动力学因子和晶界分维值，表明在陶瓷烧结初期晶粒生长动力学因子为0～2，后期为3～4；分维值随着保温时间的延长而减小；采用HP4284A测量仪测量不同气孔率样品的电容率，表明在气孔率减小的同时电容率逐渐变大。 结合实际陶瓷的烧结过程，在原有仿真工作基础上，根据MonteCarlo仿真方法建立ABO3型陶瓷晶粒生... During the firing process of ceramics, three major changes commonly occur: the number, size and shape of grain and pore. In this thesis, BaTiO3 and PZT ceramics were prepared via the conventional solid-state reaction method. Microstructure of SEM photo, Macrostructure of CCD photo and the data of porosity and shrinkage were obtained. The result showed that the samples shrunk as the porosity decrea...