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dc.contributor.author杨斌
dc.contributor.author杨防祖
dc.contributor.author黄令
dc.contributor.author许书楷
dc.contributor.author姚光华
dc.contributor.author周绍民
dc.date.accessioned2013-03-16T08:01:25Z
dc.date.available2013-03-16T08:01:25Z
dc.date.issued2007-11
dc.identifier.citation电化学,2007,13(4):425-430zh_CN
dc.identifier.issn1006-3471
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/15147
dc.description通讯作者, Tel: (86-592) 2181436, E-ma il: fzyang@ xmu. edu. cnzh_CN
dc.description.abstract[中文文摘]研究了以次磷酸钠作还原剂的化学镀铜体系,添加剂2,2′-联吡啶对化学镀铜沉积速率、次磷酸钠阳极氧化和铜离子阴极还原、以及镀层形貌、结构和组分存在状态的影响.结果表明,2,2′-联吡啶对化学沉积起阻化作用.电化学线性伏安扫描实验显示,镀液中加入2,2′-联吡啶,次磷酸钠的氧化峰电势有所负移,但峰电流减小;铜离子的还原峰电势负移,但峰电流逐渐增大.扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)及X射线光电子能谱(XPS)等实验分别表明,添加剂使镀层致密和光亮、镍含量降低;镀层为Cu-Ni合金,呈面心立方结构,无明显晶面择优取向现象;镀层中铜和镍以金属态存在,磷的质量含量小于0.05%.[英文文摘]In the bath of the electroless copper plating using sodium hypophosphite as reductant,the effects of 2,2′-dipyridine on the deposition rate,anodic oxidation of sodium hypophosphite,cathodic reduction of copper ions,surface morphologies,structure and the existing status of the deposit components were examined.The results showed that,2,2′-dipyridine hindered the electroless deposition.Experiments of liner sweep voltammetry(LSV) indicated that,as the addition of 2,2′-dipyridine to the electrolyte,the oxidation peak potentia l of sod-ium hypophosph ite shifted to amore negative value but the peak current decreased; the reduc ing peak po tentia l of copper ions moved to a more negative value whereas the peak current increased. Scanning electron microscope (SEM )、energy dispersive spectroscopy (EDS)、X-ray diffraction (XRD) and X-ray photoe lectron spectroscopic (XPS) experiments displayed tha,t the additive caused the deposit in the compacter, brighter and lower nickel content. the deposit was Cu-N i alloy in face-cen tered cubic structure without obvious crysta l face preferred orientation.the copper and nickel in the deposit were in metal state, and the weight content of phosphorus was less than 0. 05% .zh_CN
dc.description.sponsorship国家科技攻关计划项目(2004BA325C)项目资助zh_CN
dc.language.isozhzh_CN
dc.publisher《电化学》编辑部zh_CN
dc.subject化学镀铜zh_CN
dc.subject次磷酸钠zh_CN
dc.subject2; 2′-联吡啶zh_CN
dc.subjectelectroless copper platingzh_CN
dc.subjectsodium hypophosphitezh_CN
dc.subject2; 2′-dipyridinezh_CN
dc.title2,2′-联吡啶在化学镀铜中的作用研究zh_CN
dc.title.alternativeResearch of 2,2′-dipyridine on Electroless Copper Plating Using Sodium Hypophosphite as Reductantzh_CN
dc.typeArticlezh_CN


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