2_2_联吡啶和亚铁氰化钾对乙醛酸化学镀铜的影响

Abstract

[中文文摘]以乙醛酸作还原剂、Na2 EDTA 为络合剂、2, 2����-联吡啶和亚铁氰化钾作为添加剂组成化学镀铜体系,研究了两种添加剂对化学镀铜速率、镀层表面形貌、组成和结构的影响. 结果表明: 添加适量的2, 2����-联吡啶和亚铁氰化钾, 不仅提高了镀液的稳定性, 而且使沉积速率增加1倍. 这两种添加剂的同时使用, 使镀层颜色变亮, 形貌发生变化. 所得镀层是多晶铜, 没有发现夹杂Cu2O.[英文文摘]The electroless copper plating was studied in a bath consisting of glyoxylic acid as reducing agen,t N a2EDTA as comp lex ing agent， both 2, 2'-dipyridyl and K4 Fe (CN) 6 as additives, focused on the in fluence of the additives on the deposition rate, asw e ll as on the composition, structures and surface morphology of the deposits.It was found that adding an optimum amount of 2, 2'-dipyridyl and K4 Fe(CN ) 6 to the bath will not only improve the stability of the bath , but also increase the deposition rate by 100% . The simultaneous addition of both additives causes the deposits to bright appearance and the change inmorphology. The deposits were proved to be polycrystalline copper, in which no Cu2O was detected.