An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent
- 化学化工－已发表论文 
[中文文摘]以乙醛酸作还原剂, Na2 EDTA! 2H2O为络合剂, 亚铁氰化钾和2, 2 -' 联吡啶为添加剂组成化学镀铜液体系, 应用线性扫描伏安法研究分析了络合剂、添加剂对该镀铜体系电化学性能的影响. 结果表明, 络合剂N a2EDTA对乙醛酸的氧化和铜的还原有阻碍作用. 亚铁氰化钾和过量( 20 m g /L) 的2, 2 -' 联吡啶对乙醛酸的氧化起较明显的抑制作用.[英文文摘]The electroless copper plating using glyoxylic acid as a reducing agent, Na2EDTA as a che lating agent and K4 Fe( CN) 6 and 2, 2-' dipyridyl as additives was studied. The effect of chelating agent and addtives on the polangat ion behaviovs of copper reduction and glyoxylie acid oxidation were analyzed by linear sw eep vo ltammetry. The resu ltsm ainly demonstrated that the chelating agent h indered both the oxidation of glyoxylic acid and the reduction of copper complex ing ions. It has revealed that K4Fe( CN ) 6 and 2, 2 -' d ipyridyl( w ith the content over than 20 mg /L) both p layed negat ive actions on the oxidation of glyoxylic acid.