Leveling Ability of Additives and Their Effects on Structure of Cu Electrodeposits
- 化学化工－已发表论文 
采用电化学、X射线衍射和扫描电镜方法研究酸性镀铜过程中添加剂的整平能力及其对Cu电沉积层结构和表面形貌的影响.结果表明,采用本文所研制的添加剂,可以获得光亮、致密且整平能力可达到100%的Cu电沉积层;所获得的Cu镀层均不存在明显的晶面择优取向现象.镀液中光亮剂单独存在及其与整平剂共存时,镀层表面分别呈现晶粒细小致密形貌和网状结构.Leveling ability of additives and their effects on the structure and surface morphology of Cu electrodeposited in acidic electrolyte solution were studied by means of electrochemistry, XRD and SEM. The results showed that bright and tidy Cu electrodeposit in 100% leveling ability could be obtained from the electrolyte solution with the developed additives. The structure of the all obtained copper deposits were shown in obvious nonpreferred orientation. The surface morphology of Cu deposits were respectively presented in fine and tidy grains and net state when the brightener in bath was existed alone and coexisted with leveling agent.