Electrochemical Study on Electroless Copper Plating Using Sodium Hypophosphite as Reductant
- 化学化工－已发表论文 
[中文文摘] 通过电化学方法研究了以次磷酸钠为还原剂,柠檬酸钠为络合剂的化学镀铜体系．应用线性扫描伏安法,检测了温度、pH值、镍离子含量对次磷酸钠阳极氧化和铜离子阴极还原的影响．结果表明,升高温度能够加速阳极氧化与阴极还原过程;pH值的提高可促进次磷酸钠氧化,但抑制铜离子还原;镍离子的存在不仅对次磷酸钠的氧化有强烈的催化作用,而且与铜共沉积形成合金．该合金有催化活性,使化学镀铜反应得以持续进行．[英文文摘] The process of electroless copper plating, using sodium hypophosphite as the reductant and sodium citrate as the chelating agent, was studied using linear sweep voltametry. The effects of temperature, pH, and concentration of nickel ion on the anodic oxidation of hypophosphite and the cathodic reduction of copper ion were tested. The results indicated that the higher ultrasonic bath temperature accelerated both the anodic and the cathodic processes. The increasing pH value promoted hypophosphite oxidation, whereas it blocked the reduction of the copper ion. The nickel ion not only intensively catalyzed the hypophosphite oxidation, but also codeposited with the copper ion to form the Cu-Ni alloy. With regard to its catalytic activity, this alloy enabled the continuation of the electroless copper plating reaction.