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dc.contributor.authorXie, ZX
dc.contributor.author谢兆雄
dc.contributor.authorMao, BW
dc.contributor.author毛秉伟
dc.contributor.authorYang, FZ
dc.contributor.author杨防祖
dc.contributor.authorZhuo, XD
dc.contributor.authorMu, JQ
dc.contributor.authorTian, ZW
dc.contributor.author田昭武
dc.date.accessioned2012-07-30T02:17:19Z
dc.date.available2012-07-30T02:17:19Z
dc.date.issued1998
dc.identifier.citationCHEMICAL JOURNAL OF CHINESE UNIVERSITIES-CHINESE,1998,19(4):609-612zh_CN
dc.identifier.issn0251-0790
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/13377
dc.description.abstractBased on a very effective "two-step-coating" method developed for ECSTM tip preparation, highly oriented Zn-Ni alloy electroplating was studied ty in situ ECSTM, The in situ ECSTM observation showed a 3-D growth of the Zn-Ni alloy crystal in the absence of the additives. However, when additive AA-1/DIE was introduced to the plating solution, the Zn-Ni alloy crystal grew along the step and layer by layer. This result indicated that the crystal plane of lower electrochemical activity may be reserved to form the highly oriented layer along the surface of the electrode, The X-ray diffraction patterns showed a highly oriented (100) crystal plane of the deposition along the electrode surface in the presence of AA-1/DIE additive.zh_CN
dc.language.isozhzh_CN
dc.publisherHIGHER EDUCATION PRESSzh_CN
dc.subjectECSTMzh_CN
dc.subjectelectrodepositionzh_CN
dc.subjectZn-Ni alloyzh_CN
dc.titleIn situ studies of highly oriented Zn-Ni alloy electroplating by using ECSTMzh_CN
dc.typeArticlezh_CN


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