Show simple item record

dc.contributor.authorXie, ZX
dc.contributor.author谢兆雄
dc.contributor.authorMao, BW
dc.contributor.author毛秉伟
dc.contributor.authorTang, J
dc.contributor.author汤儆
dc.date.accessioned2012-07-03T01:21:55Z
dc.date.available2012-07-03T01:21:55Z
dc.date.issued1999
dc.identifier.citationCHEMICAL JOURNAL OF CHINESE UNIVERSITIES-CHINESE,1999,20(12):1957-1959zh_CN
dc.identifier.issn0251-0790
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/13134
dc.description.abstractAt cathodic potential of bulk copper deposition in dilute Cu2+ solution, tip was found to be able to induce local dissolution of copper by applying a rather positive tip potential, although meanwhile the copper was still deposited on the surface far from the tip area, The more positive the tip potential or the electrode potential is, the faster induced dissolution rate is, At a rather negative tip potential, deposition of Cu was enhanced by the tip while in the case Cu was dissolved locally with a more positive tip potential. A mechanism based on overlap of double layers between tip and substrate was proposed.zh_CN
dc.language.isozhzh_CN
dc.publisherHIGHER EDUCATION PRESSzh_CN
dc.subjectSTMzh_CN
dc.subjectnano-etchingzh_CN
dc.subjectnanodepositionzh_CN
dc.subjectCuzh_CN
dc.titleSTM tip induced local etching and deposition on Cu surfaceszh_CN
dc.typeArticlezh_CN


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record