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dc.contributor.author周宥辰
dc.contributor.author王艳艳
dc.contributor.author马志方
dc.contributor.author姜艳霞
dc.contributor.author邱瑾
dc.contributor.author孙世刚
dc.date.accessioned2012-06-24T00:27:28Z
dc.date.available2012-06-24T00:27:28Z
dc.date.issued2011-02
dc.identifier.citation电化学, 2011,17(1):31-36zh_CN
dc.identifier.issn1006-3471
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/12943
dc.description通讯作者,Tel: (86-592) 2180181,E-mail: yxjiang@xmu.edu.cnzh_CN
dc.description.abstract[中文摘要]建立一种由单一水相操作的表面等离子体共振法(SPR)制备金基底.即:在3-氨基丙基三甲氧基硅烷(APTMS)修饰的玻璃片上自组装一层细小的金胶纳米粒子,以此为催化模板,利用化学镀技术在纳米尺度范围内控制金膜的均匀增长,获得优异SPR信号响应所需要的金膜形貌和厚度.紫外光谱(UV-vis),透射电镜(TEM)观测表明,纳米金膜催化模板粒径约为2.5 nm.扫描电镜(SEM)观察湿化学镀SPR金基底均匀分布,粒径约为40 nm.与商品化真空镀金基底相比,湿化学镀金基底对乙醇的SPR响应强度相当,且可调控性更高.[英文摘要]The present study developed a preparation method of SPR gold substrate based on water phase operation.Firstly,on the glass modified by APTMS we self-assembed a gold colloid monolayer as the catalyst bed;Secondly,using the chemical plating technique,we made the gold film increase equably within the namometer range to obtain the proper shape and thinkness of the gold film required by the SPR.The analysis results of UV-vis and TEM demonstrated that the diameter of the monolayer formed from gold nanoparticles was 2.5 nm. Moreover,SEM showed that the nanoparticle prepared by electroless gold plating was uniformly distributed,whose diameter was 40 nm. The SPR flow injection experiment found that the response intensity of the SPR Au substrate made by wet chemical plating was as strong as that of the commercial SPR Au substrate made by vacuum sputtering,and the former one was more preferable to adjust the surface structure of the gold film than the later one.zh_CN
dc.description.sponsorship国家自然科学基金( 20833005,20873116,60936003) 、超分子结构和材料国家重点实验室( SKLSSM200910) 资助zh_CN
dc.language.isozhzh_CN
dc.publisher《电化学》编辑部zh_CN
dc.subject表面等离子体共振光谱(SPR)zh_CN
dc.subject湿化学镀法zh_CN
dc.subject自制SPR金基底zh_CN
dc.subject商业SPR金基底zh_CN
dc.subjectsurface plasmon resonance(SPR)zh_CN
dc.subjectwet chemical platingzh_CN
dc.subjecthomemade SPR Au substratezh_CN
dc.subjectcommercial SPR Au substrate;zh_CN
dc.title湿化学镀SPR金基底及其性能表征zh_CN
dc.title.alternativePrepartion and Characterization of SPR Au Substrate Using Wet Chemical Platingzh_CN
dc.typeArticlezh_CN


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