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dc.contributor.authorXie, ZX
dc.contributor.author谢兆雄
dc.contributor.authorKolb, DM
dc.date.accessioned2012-06-20T01:03:45Z
dc.date.available2012-06-20T01:03:45Z
dc.date.issued2000-02-14
dc.identifier.citationJOURNAL OF ELECTROANALYTICAL CHEMISTRY,2000,481(2):177-182zh_CN
dc.identifier.issn0022-0728
dc.identifier.urihttp://dx.doi.org/10.1016/S0022-0728(99)00487-8
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/12867
dc.description.abstractWith the tip of an STM, Cu can be dissolved from an electrode at potentials at which Cu dissolution should normally not occur. The dissolution process takes place only underneath the tip allowing for a nanometer scale patterning of the Cu surface. The dissolution rate is shown to depend sensitively on the tip potential as well as on the electrode potential. The electrochemical conditions are also given at which the tip influence is negligible and surfaces can be safely imaged. An explanation for the tip-induced metal dissolution on the basis of a direct charge transfer to the tip is offered. (C) 2000 Elsevier Science S.A. All rights reserved.zh_CN
dc.language.isoenzh_CN
dc.publisherELSEVIER SCIENCE SAzh_CN
dc.subjectcopper dissolutionzh_CN
dc.subjectSTMzh_CN
dc.subjectnanostructuringzh_CN
dc.titleSpatially confined copper dissolution by an STM tip: a new type of electrochemical reaction?zh_CN
dc.typeArticlezh_CN


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