Influence of multi-arc ion plating technique on the interface and microstructure of TiN/Ti and Cr/Cu contact system

Abstract

TiN/Ti film was fabricated by deposition on the chromium layer electrodeposited on the copper substrate by means of multi-are ion plating technique under different conditions. The interface formation, microstructure and constituents, and morphology for TiN/Ti and Cr/Cu contact system are investigated using X-ray diffraction (XRD) and scanning electron microscope (SEM) techniques. The XRD measurements showed that in addition to the TiN,Ti2N multi-crystallized phases,there was a lot of Cr-Ti,intermetallic compounds on the surface of TiN/Ti film. It is evident that the Ti2N phase was formed. The SEM observation indicated that the surface film prepared at 90 degreesC, had a structure similar to the form of branches and an inhomogeneous crystallization had occurred. As the temperature was increased to 170 degreesC, the XRD peak intensity became stronger and a fine TiN/Ti surface was obtained.