Show simple item record

dc.contributor.authorYang, FZ
dc.contributor.author杨防祖
dc.contributor.authorNiu, ZJ
dc.contributor.author牛振江
dc.contributor.authorCao, GM
dc.contributor.author曹刚敏
dc.contributor.authorXu, SK
dc.contributor.author许书楷
dc.contributor.authorZhou, SM
dc.contributor.author周绍民
dc.date.accessioned2012-06-14T01:19:57Z
dc.date.available2012-06-14T01:19:57Z
dc.date.issued2000
dc.identifier.citationACTA PHYSICO-CHIMICA SINICA,2000,16(11):1022-1027zh_CN
dc.identifier.issn1000-6818
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/12762
dc.description.abstractThe electrodeposition characteristics, structure and microhardness of Ni-W-P alloy have been studied by the methods of cyclic voltammetry, potentiostatic step and X-ray diffraction (XRD). The results showed that Ni-W-P alloy electrodeposit obtained from the solution containing ammonium citrate as complexing agent presented lower electrochemical activity compared with Ni-W alloy electrodeposit. Based upon the i similar to t curves of potentiostatic step, it was revealed that electrocrystallization of Ni-W-P alloy on glassy carbon electrode followed the mechanism of instantaneous nucleation and three dimensional growth with diffusion control. The crystal nucleus number on the surface of electrode was raised by the increase of overpotential. XRD experimental results showed that the Ni-W-P alloy electrodeposits obtained were obviously of the amorphous structure, and the microhardness of the alloy was about 450 kg/mm(2) at the stated plating solution and conditions.zh_CN
dc.language.isozhzh_CN
dc.publisherPEKING UNIV PRESSzh_CN
dc.subjectNi-W-P alloyzh_CN
dc.subjectelectrocrystallizationzh_CN
dc.subjectstructurezh_CN
dc.subjectmicrohardnesszh_CN
dc.titleElectrocrystallization mechanism structure and microhardness of Ni-W-P alloy eletrodepositszh_CN
dc.typeArticlezh_CN


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record