微电子封装点胶技术的研究进展

Abstract

流体点胶是一种以受控的方式对流体进行精确分配的过程,它是微电子封装行业的关键技术之一。目前,点胶技术逐渐由接触式点胶向无接触式(喷射)点胶技术转变。从微电子封装过程的应用出发,对点胶技术的发展进行了概述;在对比各种点胶方式的同时,重点介绍了无接触式喷射点胶技术,以及其中所涉及的关键技术,并提出了评价点胶品质的标准。

Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner,it is one of the key technologies of microelectronics packaging.At present,there is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods,such evolution will bring a great change for the dispensing industry.Based on the applications of dispensing technology in microelectronics packaging processes,dispensing technical development process was overviewed.Contrasting the features and performances of various methods,the non-contact jetting technology was mainly highlighted,including its key technologies and the evaluation standard of dispensing quality.