• 中文
    • English
  • English 
    • 中文
    • English
  • Login
View Item 
  •   DSpace Home
  • 航空航天学院
  • 航空航天-已发表论文
  • View Item
  •   DSpace Home
  • 航空航天学院
  • 航空航天-已发表论文
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

微电子封装点胶技术的研究进展
Advances in Fluid Dispensing Technology for Micro-electronics Packaging

Thumbnail
Full Text
微电子封装点胶技术的研究进展.pdf (906.7Kb)
Date
2011
Author
孙道恒
高俊川
杜江
江毅文
陶巍
王凌云
Collections
  • 航空航天-已发表论文 [2242]
Show full item record
Abstract
流体点胶是一种以受控的方式对流体进行精确分配的过程,它是微电子封装行业的关键技术之一。目前,点胶技术逐渐由接触式点胶向无接触式(喷射)点胶技术转变。从微电子封装过程的应用出发,对点胶技术的发展进行了概述;在对比各种点胶方式的同时,重点介绍了无接触式喷射点胶技术,以及其中所涉及的关键技术,并提出了评价点胶品质的标准。
 
Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner,it is one of the key technologies of microelectronics packaging.At present,there is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods,such evolution will bring a great change for the dispensing industry.Based on the applications of dispensing technology in microelectronics packaging processes,dispensing technical development process was overviewed.Contrasting the features and performances of various methods,the non-contact jetting technology was mainly highlighted,including its key technologies and the evaluation standard of dispensing quality.
 
Citation
中国机械工程,2011,(20):123-129
URI
https://dspace.xmu.edu.cn/handle/2288/125402

copyright © 2002-2016  Duraspace  Theme by @mire  厦门大学图书馆  
About | Policies
 

 

Browse

All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

My Account

LoginRegister

copyright © 2002-2016  Duraspace  Theme by @mire  厦门大学图书馆  
About | Policies