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The formation of copper electrodeposits with highly preferred orientation and their surface morphology

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高择优取向铜镀层的电化学形成及其表面形貌.pdf (894.8Kb)
Date
2002
Author
Gu, M
辜敏
Yang, FZ
杨防祖
Huang, L
黄令
Yao, SB
姚士冰
Zhou, SM
周绍民
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  • 化学化工-已发表论文 [14469]
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Abstract
Cu electrodeposits with highly preferred orientations were obtained from H2SO4-CuSO4 electrolytic solution. XRD results indicated that at current densities 1.0 similar to 6.0 Angstrom (.) dm(-2) and 15.0 Angstrom (.) dm(-2), the obtained Cu electrodeposits were respectively shown in (220) and (111) highly preferred orientations. The value of texture coefficient of Cu electrodeposited at a stationary current density was increased with its thickness. SEM results revealed that the surface morphology of the electrodeposits with (220) texture obtained at 4.0 Angstrom (.) dm(-2) appeared in network combined with needle crystals, and texture with (111) at 15.0 Angstrom (.) dm(-2) in hexagonal pyramid. The changes of the preferred orientation effected by current density were mainly attributed to the competitions between the grains growing direction and the rate during Cu electrocrystallization.
Citation
ACTA PHYSICO-CHIMICA SINICA,2002,18(11):973-978
URI
https://dspace.xmu.edu.cn/handle/2288/12295

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