The formation of copper electrodeposits with highly preferred orientation and their surface morphology

Abstract

Cu electrodeposits with highly preferred orientations were obtained from H2SO4-CuSO4 electrolytic solution. XRD results indicated that at current densities 1.0 similar to 6.0 Angstrom (.) dm(-2) and 15.0 Angstrom (.) dm(-2), the obtained Cu electrodeposits were respectively shown in (220) and (111) highly preferred orientations. The value of texture coefficient of Cu electrodeposited at a stationary current density was increased with its thickness. SEM results revealed that the surface morphology of the electrodeposits with (220) texture obtained at 4.0 Angstrom (.) dm(-2) appeared in network combined with needle crystals, and texture with (111) at 15.0 Angstrom (.) dm(-2) in hexagonal pyramid. The changes of the preferred orientation effected by current density were mainly attributed to the competitions between the grains growing direction and the rate during Cu electrocrystallization.