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dc.contributor.authorGu, M
dc.contributor.author辜敏
dc.contributor.authorYang, FZ;
dc.contributor.author杨防祖
dc.contributor.authorHuang, L
dc.contributor.author黄令
dc.contributor.authorYao, SB
dc.contributor.author姚士冰
dc.contributor.authorZhou, SM
dc.contributor.author周绍民
dc.date.accessioned2012-05-05T01:57:11Z
dc.date.available2012-05-05T01:57:11Z
dc.date.issued2002
dc.identifier.citationACTA CHIMICA SINICA,2002,60(11):1946-1950zh_CN
dc.identifier.issn0567-7351
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/12254
dc.description.abstractThe initial stage of copper electrodeposition and the influence of chloride ions on the nucleation and growth of copper on glass carbon from acid sulphate solution were studied by using the cyclic voltammetry and the chronoamperometry method. Instantaneous nucleation with three-dimensional growth is found for the solutions either with or without chloride. Obviously, chloride ions increase the nucleation rate and the nuclear number density of nuclei at the surface. Since the deposits are smooth, bright at high nuclear number densities, it can be concluded that chloride ions effectively promote the smooth and brightness of surface. The higher nuclear number densities are obtained at 10 similar to 20 mg . L-1 of chloride ions. Maintaining the optimum level chloride ion concentration is beneficial to electrodeposits.zh_CN
dc.language.isozhzh_CN
dc.publisherSCIENCE CHINA PRESSzh_CN
dc.subjectcopperzh_CN
dc.subjectchloridezh_CN
dc.subjectglass carbonzh_CN
dc.subjectelectrocrystallizationzh_CN
dc.titleEffect of chloride ion on electrocrystallization of copper on glass carbon electrodezh_CN
dc.typeArticlezh_CN


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