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dc.contributor.authorJia Fei
dc.contributor.author贾飞
dc.contributor.authorWang Zhou-Cheng
dc.contributor.author王周成
dc.date.accessioned2012-03-16T01:15:53Z
dc.date.available2012-03-16T01:15:53Z
dc.date.issued2011
dc.identifier.citationACTA PHYSICO-CHIMICA SINICA,2011,27(3):633-640zh_CN
dc.identifier.issn1000-6818
dc.identifier.uriWOS:000288005200019
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/11765
dc.description.abstractWe studied electroless Ni-B plating with sodium borohydride as the reductant by linear sweep voltammetry. The effects of bath solution composition and operating conditions on the cathodic reduction and anodic oxidation were studied. Increases in the concentrations of nickel acetate and sodium borohydride accelerated the reduction of Ni(2+) and the oxidation of BH(4)(-), respectively. Ethylenediamine, sodium hydroxide, thiourea and saccharin sodium inhibited both the cathodic and anodic reactions to varying degrees. Additionally, sulfur in the additives promoted the dissolution of nickel. High temperature was beneficial to both the cathodic reduction and anodic oxidation.zh_CN
dc.description.sponsorshipNational Natural Science Foundation of China[20573086]zh_CN
dc.language.isoenzh_CN
dc.publisherPEKING UNIV PRESSzh_CN
dc.subjectElectroless nickel platingzh_CN
dc.subjectCathodic reductionzh_CN
dc.subjectAnodic oxidationzh_CN
dc.subjectPolarizationzh_CN
dc.subjectAdditivezh_CN
dc.subjectAdsorptionzh_CN
dc.titleElectrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductantzh_CN
dc.typeArticlezh_CN


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