Preparation and self-assembly of copper nanoparticles via discharge of copper rod electrodes in a surfactant solution: a combination of physical and chemical processes
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Cu nanoparticles with a mean diameter of 10-15 nm were prepared and self-assembled via discharge of bulk copper rods in a cetyltrimethylammonium bromide (CTAB)/ascorbic acid solution. Ascorbic acid was used as a protective agent to prevent the nascent Cu nanoparticles from oxidation in the solution;, otherwise spindle-like Cu2O/CuO structures, with a lateral dimension of 30-50nm and length of up to 100nm, were formed in pure deionized water. The surfactant CTAB had a critical influence on self-assembly of spherical Cu nanostructures (with diameter of 700 nm-1mum). Such a low-temperature and non-vacuum method, exhibiting the characters of both physical and chemical processes, provides a versatile choice for economical preparation and assembly of various metal nanostructures. (C) 2004 Elsevier Inc. All rights reserved.