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dc.contributor.authorHU Guang-hui
dc.contributor.authorWU Hui-huang
dc.contributor.author吴辉煌
dc.contributor.authorYAN G Fang-zu
dc.contributor.author杨防祖
dc.contributor.authorLIU Xin-yu
dc.date.accessioned2011-12-08T02:25:06Z
dc.date.available2011-12-08T02:25:06Z
dc.date.issued2004
dc.identifier.citationCHEMICAL RESEARCH IN CHINESE UNIVERSITIES,2004,20(6):757-760zh_CN
dc.identifier.issn1005-9040
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/11355
dc.description.abstractThe effect of thiourea(TU) on the nickel deposition process was analyzed by means of linear-sweep voltammetry. Raman spectroscopy and infrared reflectance spectroscopy were used to investigate the adsorption of TU and the formation of nickel-TU complexes on copper surface. The experimental results indicate that the nucleation and the preceding conversion step are involved in the deposition of nickel on copper electrodes. TU makes the onset nucleation potential negative due to the formation of nickel-TU complexes, which can accelerate the nickel deposition. Moreover, the S atom in the TU molecule adsorbed on copper surface facilitates the coordination of TU to Ni2+. Meanwhile, TU might be adsorbed at a flatter orientation if no Ni2+ is on the surface, while at a perpendicular orientation when Ni2+ is coadsorbed.zh_CN
dc.language.isozhzh_CN
dc.publisherHIGHER EDUCATION PRESSzh_CN
dc.subjectthiourea (TU)zh_CN
dc.subjectnickel depositionzh_CN
dc.subjectadsorptionzh_CN
dc.subjectpreceding conversion processzh_CN
dc.titleAdsorption of thiourea and formation of nickel-thiourea complexes at initial stage of nickel depositionzh_CN
dc.typeArticlezh_CN


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