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dc.contributor.authorKang Shi
dc.contributor.author时康
dc.contributor.authorJing Tang
dc.contributor.author汤儆
dc.contributor.authorLi Zhang
dc.contributor.authorYong-liang Zhou
dc.contributor.author周勇亮
dc.contributor.authorDong-sheng Qu
dc.contributor.authorLi-Ning Sun
dc.contributor.authorZhong-Qun Tian
dc.contributor.author田中群
dc.date.accessioned2011-11-16T14:56:26Z
dc.date.available2011-11-16T14:56:26Z
dc.date.issued2005
dc.identifier.citationJOURNAL OF SOLID STATE ELECTROCHEMISTRY,2005,9(5):398-402zh_CN
dc.identifier.issn1432-8488
dc.identifier.urihttp://dx.doi.org/doi:10.1007/s10008-004-0636-4
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/11194
dc.description.abstractChemical micro-machining of complex 3-dimensional (3-D) patterns of silicon substrates was preliminarily explored by the confined etchant layer technique (CELT). Through systematic investigation, we demonstrated that cysteine as a scavenger and Br-2 as an etchant can be used to etch silicon substrates. The CELT has the potential to develop into a new means of micro-machining complex 3-D patterns on silicon substrates. However, due to the highly corrosive property of the chemicals used for the silicon etched system, great effort must be made to overcome these problems including the mold electrode with high chemical stability.zh_CN
dc.language.isoenzh_CN
dc.publisherSPRINGERzh_CN
dc.subjectmicro-machiningzh_CN
dc.subjectconfined etchant layer techniquezh_CN
dc.subjectcysteinezh_CN
dc.subjectsiliconzh_CN
dc.subjectetchingzh_CN
dc.titleA preliminary study on chemical micro-machining of complex three-dimensional patterns on silicon substrateszh_CN
dc.typeArticlezh_CN


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