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电镀液和电镀层中铜和锰的联合测定
Combined Determination of Copper and Manganese in Electroplating Solution and Electroplated Layer by Spectrophotometry

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电镀液和电镀层中铜和锰的联合测定.pdf (203.5Kb)
Date
1999
Author
王尊本
王润棠
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  • 化学化工-已发表论文 [14237]
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Abstract
当PH=10时,铜和锰都能与PAr生成稳定的红色络合物;当PH=7时,锰与PAr几乎不络合,而铜与PAr则可以稳定络合.利用这种差异,可以在PH=10的介质中测定铜和锰的合量,而在PH=7的介质中测定铜的量,再由两者之差求得锰的含量.试验表明,PH=10.0时,εCu-PAr498.5=4.66x104l/MOl·CM;εMn-PAr498.5=8.00x104l/MOl·CM;PH=7.0时,εCu-PAr498.5=4.26x104l/MOl·CM.相对标准偏差小于3%,回收率为95%~101%.其方法适用于电镀液和电镀层中Cu和Mn的测定
 
Cu 2+ and Mn 2+ can complex with PAR to form stable red compounds at pH = 10.0.At lower pH values, Mn 2+ cann′t complex with PAR ,while Cu PAR is still stable and remains a relatively high absorbance.According to this difference , Cu 2+ and Mn 2+ can be determined at different pH in the aqueous phase by spectrophotometry.The molar absorptivities of the two complexes are found to be 4.66×10 4 L/mol·cm (for Cu 2+ at pH=10.0), 4.26×10 4 L/mol·cm(for Cu 2+ at pH=7.0) and 8.00×10 4 L/mol·cm(for Mn 2+ at pH =10.0) respectively.The relative standard deviations are less than 3 % and the recoveries are 95%~101% .This method is applied to determine the content of Cu and Mn in the electroplating solution and electroplated layer.
 
Citation
厦门大学学报(自然科学版),1999,(4):82-88
URI
https://dspace.xmu.edu.cn/handle/2288/107661

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