镍镀层中微量六方晶格镍的存在与稳定性研究
Studies on the Existence and Stability of Hexagonal Structure Nickel in Electrodeposited Ni
Abstract
对由含糖精的WATTS液得到的镍镀层(含硫镍)和WATTS镍镀层(无硫镍)进行透射电镜观察及选区电子衍射实验,结果表明无硫镍镀层呈粒状结构,晶粒尺寸在100~500nM之间,属面心立方结构;含硫镍镀层为层状结构,层间距在700~1500nM之间,每层又由许多宽约200~300nM的小层组成,晶粒尺寸约20~30nM,大部分属面心立方结构,在层与层交界处发现有少量六方结构镍晶体,差示扫描量热法实验表明,在约180℃左右六方结构镍转化为更稳定的面心立方结构。 SulFur-containing Ni and sulFur-Free Ni deposits have been studied by means of transmission electron microscopy and selected area electron diFFraction.The results showed that sulFur-Free Ni deposit is of grainy structure, the grain size is about l00-500 nm and the structure is FCC, and sulFur-containing Ni deposit is of laminated structure, the layer thickness is about 200-300 nm, the gain size is about 20-30 nm.Besides FCC Ni,a hexagonal structure Ni is also Found between the layers in the sulFur-containing Ni deposit.The diFFerential scanning calorimetry experiment of the Ni deposits showed that the hexagonal structure Ni would be transFered into more stable FCC Ni at near l80℃.