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dc.contributor.author杨防祖
dc.contributor.author蒋义锋
dc.contributor.author田中群
dc.contributor.author周绍民
dc.date.accessioned2016-05-17T02:53:32Z
dc.date.available2016-05-17T02:53:32Z
dc.date.issued2013-11-15
dc.identifier.citation电镀与精饰,2013,35(248):14-19+51
dc.identifier.issn1001-3849
dc.identifier.otherDYJI201311004
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/106886
dc.description.abstract介绍了无氰镀铜工艺,包括预镀镍、酸性预镀铜、浸铜、焦磷酸盐镀铜、HEdP和有机膦酸多元络合镀铜、乙二胺镀铜、EdTA镀铜、一价铜镀铜和柠檬酸盐-酒石酸盐镀铜等工艺,介绍了各种预镀铜工艺的特点;阐述了柠檬酸盐-酒石酸盐镀铜需要考虑和解决的问题。
dc.description.abstractInformation for non-cyanide copper plating processes,including nickel pre-plating,acidic copper pre-plating,copper immersion,pyrophosphate copper plating,HEDP(1-hydroxyethylidene-1,1-diphosphonic acid) bath copper plating,ethylenediamine bath copper plating,EDTA bath copper plating,cuprous ions bath copper plating and citrate/tartrate bath copper plating,were introduced,and characteristics of the above processes were stated.Problems need to be considered and solved in citrate/tartrate bath copper plating were also proposed.
dc.description.sponsorship国家自然科学基金项目(No.21021002); 国家重点基础研究发展计划(No.2009CB930703)资助; 福建省科技计划创新资金项目(闽科计[2013]14号); 福建省经贸委企业技术创新专项资金(闽经贸计财[2011]702号)
dc.language.isozh_CN
dc.subject无氰镀铜
dc.subject资讯
dc.subject柠檬酸盐
dc.subject酒石酸盐
dc.subjectnon-cyanide copper plating
dc.subjectinformation
dc.subjectcitrate
dc.subjecttartrate
dc.title无氰镀铜资讯
dc.title.alternativeInformation for Non-cyanide Copper Plating
dc.typeArticle


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