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dc.contributor.author蔡加勒
dc.contributor.author周绍民
dc.date.accessioned2016-05-17T02:52:24Z
dc.date.available2016-05-17T02:52:24Z
dc.date.issued1995
dc.identifier.citation表面技术,1995,(3):27-31+54
dc.identifier.issn1001-3660
dc.identifier.otherBMJS199503008
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/106563
dc.description.abstract介绍线性扫描伏安法的定量分析原理和电镀工业分析中的应用,利用dd系列电镀参数测试仪中的“极谱”功能进行线性扫描伏安法分析,提供电镀方面定量分析实例。
dc.description.abstractThe principles of quantitative analysis by linear scan voltammetry and their analytical application in electroplating were discussed.The quantitative analysis by Linear scan voltammetry was perFormed using "polarography" Function in a series of DD multi-purpose instruments For electroplater some practical examples For quantitative analysis in electroplating had been supplied .
dc.language.isozh_CN
dc.subject伏安法
dc.subject定量分析
dc.subject电镀
dc.subject镀液
dc.title线性扫描伏安法在电镀工业中的分析应用
dc.title.alternativeAnalytical Application of Linear Scan Voltammetry in Electroplating
dc.typeArticle


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