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线性扫描伏安法在电镀工业中的分析应用
Analytical Application of Linear Scan Voltammetry in Electroplating

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Date
1995
Author
蔡加勒
周绍民
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  • 化学化工-已发表论文 [14237]
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Abstract
介绍线性扫描伏安法的定量分析原理和电镀工业分析中的应用,利用dd系列电镀参数测试仪中的“极谱”功能进行线性扫描伏安法分析,提供电镀方面定量分析实例。
 
The principles of quantitative analysis by linear scan voltammetry and their analytical application in electroplating were discussed.The quantitative analysis by Linear scan voltammetry was perFormed using "polarography" Function in a series of DD multi-purpose instruments For electroplater some practical examples For quantitative analysis in electroplating had been supplied .
 
Citation
表面技术,1995,(3):27-31+54
URI
https://dspace.xmu.edu.cn/handle/2288/106563

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