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dc.contributor.author吴万尧
dc.contributor.author余谋发
dc.contributor.author林国良
dc.date.accessioned2016-05-17T02:50:48Z
dc.date.available2016-05-17T02:50:48Z
dc.date.issued2009
dc.identifier.citation厦门大学学报(自然科学版),2009,(2):109-112
dc.identifier.issn0438-0479
dc.identifier.otherXDZK200902023
dc.identifier.urihttps://dspace.xmu.edu.cn/handle/2288/106138
dc.description.abstract为改善双酚A型环氧树脂的耐热性,采用二苯基硅二醇单体与环氧树脂E-44直接开环加成聚合的方法.以辛酸亚锡作催化剂、4,4′-二氨基二苯基砜(ddS)为固化剂,研究了反应条件和E-44与二苯基硅二醇的物质的量配比对改性产物耐热性能的影响.通过傅立叶红外光谱仪(fT-Ir)、动态热机械仪(dMTA)、热失重分析仪(TgA)进行分析,得出最佳反应条件是150℃/2H,配比为3∶1时,改性环氧树脂的玻璃化转变温度(Tg)为147.45℃,分解温度(Td)达到490.5℃(热失重50%).实验结果表明:二苯基硅二醇改性可以提高环氧树脂的耐热性能.
dc.description.abstractIn order to enhance the heat resistance of diglycidyl ethers of bisphenol A type epoxy resin,in this paper,epoxy resin(E-44) was modified with diphenylsilandiol monomer through direct ring-opening addition.With stannous octanoate as the catalyst and 4,4′-diaminodiphenylsulfone(DDS) as the curing agent,we studied the influence of reaction conditions and the molar ratio of resin and diphenylsilandiol on the heat resistance of modified products.Through fourier transform infrared spectroscopy analysis(FT-IR),dynamic thermal mechanical analysis(DMTA)and thermogravimetric analyzer(TGA),the best reaction conditions and molar ratio were obtained to be 150℃/2 h and 3∶1,respectively.Glass transition temperature(Tg) is 147.45℃,and temperature at 50% loss is 490.5℃.The results reveal modification by diphenylsilandiol can enhance the heat resistance of epoxy resin.
dc.language.isozh_CN
dc.subject双酚A型环氧树脂
dc.subject二苯基硅二醇
dc.subject耐热性能
dc.subjectbisphenol A epoxy resin
dc.subjectdiphenylsilandiol
dc.subjectheat resistance
dc.title二苯基硅二醇改性环氧树脂耐热性的研究
dc.title.alternativeInvestigation on Heat Resistance of Epoxy Resin Modified with Diphenylsilandiol
dc.typeArticle


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