MEMS接触电容式高温压力传感器的温度效应

Abstract

介绍了一种基于SOI/硅片键合技术制作的接触电容式高温压力传感器结构,并对传感器的测试装置、测试方法进行详细的介绍后,对传感器进行压力测试和温度特性测试。压力测试结果表明,传感器线性工作区压力为110~280 kPA,灵敏度约为0.14 Pf/kPA;温度特性测试结果表明,传感器具有正温度效应,在30~300℃,传感器输出误差约为0.5%。文中还分析了热胀冷缩及介电常数温度系数对传感器温度效应的影响,以及设计了参考电容及运算放大器式传感器测量电路来消除温度效应。

This paper introduces the structure of the MEMS high temperature touch-mode capacitive pressure sensor which is bases on the SOI / Silicon fusion bonding technique.Its testing device and method are presented in detail,and the tests on the sensor's pressure and temperature are conducted in high temperature.The results of the pressure test show that the linear operating range of the sensor is about 110 ~ 280 kPa and its sensitivity is about0.14 pF / kPa.The results of the temperature test reveal that the sensor has a positive temperature effect and its output error rate is about 0.5% in a temperature range of 30 ~ 300℃.Also the paper analyzes the influence of heat expansion and cold contraction,as well as the temperature coefficient of permittivity,on the sensor's temperature effect,and designs the reference capacitance and op-amp sensor measurement circuit to eliminate the temperature effect.